They now use intrusive soldering that solders surface mount and through-hole components at the same time:

The idea behind intrusive soldering, also known as pin-in-paste soldering is simple: solder paste is printed onto or around a through-hole pad, and the through-hole component is passed into reflow with your SMD components. The molten solder paste then fills in the through-hole and attaches the component pin.

It’s probably this recent bug in kernel/mesa. https://gitlab.archlinux.org/archlinux/packaging/packages/linux/-/issues/47

You need to downgrade your kernel or wait for the fix…